We have developed a liquid crystal polymer (LCP) encapsulation technology for RF MEMS. The RF MEMS devices are flip-chip interconnected with other circuit elements on an alumina substrate. After flip-chip device transfer, LCP is used to encapsulate the device on the substrate. This approach is similar to glob-top encapsulation used for low-cost microelectronic packaging. The effectiveness of LCP (Vectra A950) sealing has been demonstrated by monitoring the moisture level inside the package under a 100% RH environment. In addition, the LCP’s permeabilities to helium and nitrogen were measured through a standard membrane characterization setup. These permeabilities were proven to be in the same level as those of glasses used for hermetic sealing. LCP is an excellent encapsulation material for hermetic or near-hermetic packaging of RF MEMS.

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