We have developed a liquid crystal polymer (LCP) encapsulation technology for RF MEMS. The RF MEMS devices are flip-chip interconnected with other circuit elements on an alumina substrate. After flip-chip device transfer, LCP is used to encapsulate the device on the substrate. This approach is similar to glob-top encapsulation used for low-cost microelectronic packaging. The effectiveness of LCP (Vectra A950) sealing has been demonstrated by monitoring the moisture level inside the package under a 100% RH environment. In addition, the LCP’s permeabilities to helium and nitrogen were measured through a standard membrane characterization setup. These permeabilities were proven to be in the same level as those of glasses used for hermetic sealing. LCP is an excellent encapsulation material for hermetic or near-hermetic packaging of RF MEMS.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Liquid Crystal Polymer for RF MEMS Packaging
Faheem F. Faheem,
Faheem F. Faheem
University of Colorado, Boulder, CO
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Y. C. Lee
Y. C. Lee
University of Colorado, Boulder, CO
Search for other works by this author on:
Faheem F. Faheem
University of Colorado, Boulder, CO
Y. C. Lee
University of Colorado, Boulder, CO
Paper No:
IPACK2005-73442, pp. 2061-2065; 5 pages
Published Online:
March 4, 2009
Citation
Faheem, FF, & Lee, YC. "Liquid Crystal Polymer for RF MEMS Packaging." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 2061-2065. ASME. https://doi.org/10.1115/IPACK2005-73442
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