Macro-models (also called “reduced-order-models”, “lumped parameter models”, etc.) are convenient and efficient design tools that afford reasonable simulation accuracy by replacing the governing physical equations with behavioral models. Such models are easy to implement, usually do not require grid formulations, employ simple numerical schemes (systems of ordinary differential equations or algebraic equations), and have robust numerical convergence. In this study macro-models were developed for predicting the filling of micro-chambers for capillary driven flows as a function of geometric parameters and fluid properties (viscosity, surface tension and contact angle). It was found that bubble formation in filling of micro-chambers is a strong function of wall contact angles. A region of wall influence parameter was identified which was found to be relatively insensitive to flow parameters (flow rate, viscosity, etc.) and depends strongly on the wettability of the side walls of the micro-chambers.
Skip Nav Destination
ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Experimental Validation of Macro-Models for Simulating Capillary Driven Multiphase Flows Used for Micro-Chamber Filling
Debjyoti Banerjee
Debjyoti Banerjee
Texas A&M University, College Station, TX
Search for other works by this author on:
Debjyoti Banerjee
Texas A&M University, College Station, TX
Paper No:
IPACK2005-73412, pp. 2017-2021; 5 pages
Published Online:
March 4, 2009
Citation
Banerjee, D. "Experimental Validation of Macro-Models for Simulating Capillary Driven Multiphase Flows Used for Micro-Chamber Filling." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 2017-2021. ASME. https://doi.org/10.1115/IPACK2005-73412
Download citation file:
5
Views
Related Proceedings Papers
Related Articles
Simulation of Void Growth in Molten Solder Bumps
J. Electron. Packag (September,2003)
A Level Set Method Coupled With a Volume of Fluid Method for Modeling of Gas-Liquid Interface in Bubbly Flow
J. Fluids Eng (August,2010)
Viscous Fingering in a Hele-Shaw Cell With Finite Viscosity Ratio and Interfacial Tension
J. Fluids Eng (March,2003)
Related Chapters
Completing the Picture
Air Engines: The History, Science, and Reality of the Perfect Engine
Fundamentals of Finite Element and Finite Volume Methods
Compact Heat Exchangers: Analysis, Design and Optimization using FEM and CFD Approach
Multiphase Flow Simulations of Sediment Particles in Mixed-flow Pumps
Mixed-flow Pumps: Modeling, Simulation, and Measurements