This paper describes low-cost materials and processes for embedded thin film resistors that can be integrated into printed wiring board using sequential build-up processes. Realization of embedded resistors on conventional board level high loss epoxy (∼0.015 at 1 GHz) and proposed low loss BCB dielectric (∼0.0008 at > 40 GHz) has been explored in this study. Foil transfer and electroless plating have been attempted for embedding thin film resistors. Ni-P alloys were plated using conventional electroless plating, and NiCr and NiCrAlSi foils were used for the foil transfer process. A test vehicle consisting of various geometry and values of resistors was designed and fabricated to evaluate electrical and mechanical reliability of embedded thin film resistors. For the first time, Benzocyclobutene (BCB) has been proposed as a board level dielectric for advanced System-on-Package (SOP) module primarily due to its attractive low-loss (for RF application) and thin film (for high density wiring) properties. To realize embedded resistors on multi-layer BCB, a low-cost large format electroless process for deposition of NiP and NiWP thin film resistors using both low- (25°C) and high-temperature (90°C) baths has been developed. The electroless process exhibits uniform resistor thickness in the sub-micron range and offers low profile and excellent adhesion to BCB dielectric. These films also act as a seed layer for the subsequent direct electroplating of copper traces. NiP alloys can also be tailored to variable temperature coefficient of resistance (TCR) with different alloy compositions. The electroless process can be adopted in the PCB manufacturing industries with no additional investment.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
SOP Embedded Thin Film Resistors on High and Low Loss Thin Film Dielectrics Available to Purchase
Swapan Bhattacharya,
Swapan Bhattacharya
Georgia Institute of Technology, Atlanta, GA
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Mahesh Varadarajan,
Mahesh Varadarajan
Georgia Institute of Technology, Atlanta, GA
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Premjeet Chahal,
Premjeet Chahal
Georgia Institute of Technology, Atlanta, GA
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K. J. Lee,
K. J. Lee
Georgia Institute of Technology, Atlanta, GA
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Ajanta Bhattacharjee,
Ajanta Bhattacharjee
Georgia Institute of Technology, Atlanta, GA
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Rao R. Tummala,
Rao R. Tummala
Georgia Institute of Technology, Atlanta, GA
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Suresh Sitaraman,
Suresh Sitaraman
Georgia Institute of Technology, Atlanta, GA
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John Papapolymerou,
John Papapolymerou
Georgia Institute of Technology, Atlanta, GA
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Manos Tentzeris,
Manos Tentzeris
Georgia Institute of Technology, Atlanta, GA
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Joy Laskar
Joy Laskar
Georgia Institute of Technology, Atlanta, GA
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Swapan Bhattacharya
Georgia Institute of Technology, Atlanta, GA
Mahesh Varadarajan
Georgia Institute of Technology, Atlanta, GA
Premjeet Chahal
Georgia Institute of Technology, Atlanta, GA
K. J. Lee
Georgia Institute of Technology, Atlanta, GA
Ajanta Bhattacharjee
Georgia Institute of Technology, Atlanta, GA
Rao R. Tummala
Georgia Institute of Technology, Atlanta, GA
Suresh Sitaraman
Georgia Institute of Technology, Atlanta, GA
John Papapolymerou
Georgia Institute of Technology, Atlanta, GA
Manos Tentzeris
Georgia Institute of Technology, Atlanta, GA
Joy Laskar
Georgia Institute of Technology, Atlanta, GA
Paper No:
IPACK2005-73500, pp. 1999-2004; 6 pages
Published Online:
March 4, 2009
Citation
Bhattacharya, S, Varadarajan, M, Chahal, P, Lee, KJ, Bhattacharjee, A, Tummala, RR, Sitaraman, S, Papapolymerou, J, Tentzeris, M, & Laskar, J. "SOP Embedded Thin Film Resistors on High and Low Loss Thin Film Dielectrics." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1999-2004. ASME. https://doi.org/10.1115/IPACK2005-73500
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