In order to obtain full information on the high frequency performance of embedded passive elements, we design test elements group (TEG) substrates and compare the simulation result with measured data. S-parameters of spiral inductors embedded in low temperature co-fired ceramic (LTCC) substrates are simulated using high frequency structure simulator (HFSS), microwave studio (MWS) and advanced design simulator (ADS). Then effective inductance and Q factors are calculated from S-parameters after de-embedding process. Measurements of S-parameters are performed using a vector network analyzer in the frequency range up to 15 GHz. The simulation result with dimensional data measured by laser microscope and X-lay microscope is in good agreement with the experimental result. It is suggested that the simulation results can be applied to the design of system-in-a-package (SiP) substrate directly without making TEG.

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