This paper will describe the high-frequency analysis and characterization of embedded resistors fabricated in organic substrates. Although embedded resistors have been widely used in organic substrates, detailed analysis and characterization at high frequencies have received very limited attention. Majority of previous research work focuses on low frequency performance and manufacturing considerations. In this research work, a novel embedded resistor fabrication technique was employed to allow design on demand implementation of resistors. Analysis and characterization were carried out for frequencies up to 20 GHz, along with a comparison between embedded resistors and discrete surface mount resistors. It can be deduced that the degraded performance in the discrete implementation occurs above 1 GHz and is mainly attributed to surface mount parasitics. Embedded resistors, in contrast, offer significantly better broadband performance up to 20 GHz, in spite of inferior tolerances within 20%. This results show that embedded resistors not only achieve improved area utilization but also greatly improved high-frequency performance.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Analysis and Characterization of Embedded Resistors for Wideband Applications Available to Purchase
Albert C. W. Lu,
Albert C. W. Lu
Singapore Institute of Manufacturing Technology, Singapore
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L. L. Wai,
L. L. Wai
Singapore Institute of Manufacturing Technology, Singapore
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W. Fan,
W. Fan
Singapore Institute of Manufacturing Technology, Singapore
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Stephen C. K. Wong,
Stephen C. K. Wong
Singapore Institute of Manufacturing Technology, Singapore
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Toshio Yamazaki,
Toshio Yamazaki
Hitachi Chemical (Singapore) Pte Ltd., Singapore
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Jacinto Jun Jarcia, Jr.,
Jacinto Jun Jarcia, Jr.
Hitachi Chemical (Singapore) Pte Ltd., Singapore
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Kim H. Chin
Kim H. Chin
Hitachi Chemical (Singapore) Pte Ltd., Singapore
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Albert C. W. Lu
Singapore Institute of Manufacturing Technology, Singapore
L. L. Wai
Singapore Institute of Manufacturing Technology, Singapore
W. Fan
Singapore Institute of Manufacturing Technology, Singapore
Stephen C. K. Wong
Singapore Institute of Manufacturing Technology, Singapore
Toshio Yamazaki
Hitachi Chemical (Singapore) Pte Ltd., Singapore
Jacinto Jun Jarcia, Jr.
Hitachi Chemical (Singapore) Pte Ltd., Singapore
Kim H. Chin
Hitachi Chemical (Singapore) Pte Ltd., Singapore
Paper No:
IPACK2005-73345, pp. 1979-1984; 6 pages
Published Online:
March 4, 2009
Citation
Lu, ACW, Wai, LL, Fan, W, Wong, SCK, Yamazaki, T, Jarcia, JJ, Jr., & Chin, KH. "Analysis and Characterization of Embedded Resistors for Wideband Applications." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1979-1984. ASME. https://doi.org/10.1115/IPACK2005-73345
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