This paper discusses the design, modeling and characterization of RF inductors and baluns in a multilayer organic substrate. In the first part of the paper, we systematically look at two types of spiral inductors for RF applications. More than 40 multi-turn spiral inductors covering inductance values from a few nH to 20 nH have been fabricated and fully characterized. Single turn inductors suitable for high-frequency applications with inductance values in the sub-nH range have also been fabricated and evaluated. In the second part of the paper, we discuss the design of a Marchand-type balun for 2.4 GHz Bluetooth and WLAN application. This 50:100-Ohm balun design employs staggered trace arrangement which results in improved insertion loss and robust performance. Both measurement and simulation data are presented to validate the package-embedded components.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Integration of RF Inductors and Baluns in Multilayer Organic Substrates
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Kamgaing, T, Lee, CH, Hwang, K, Zeng, XY, He, J, Hsu, R, Min, Y, & Ihm, J. "Integration of RF Inductors and Baluns in Multilayer Organic Substrates." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1973-1977. ASME. https://doi.org/10.1115/IPACK2005-73316
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