Integrating passive components on package is getting more and more attractive. To speed up the lumped-elements-based RF functional blocks, like filters, matching networks and so on, fast synthesis of these lumped elements is necessary. Traditional synthesis method like try-error-try again is not only time consuming but also hard to find an optimal one. This is especially true for spiral inductor design due to many tunable parameters. Design based on library has also some disadvantages, such as lack of information of manufacture tolerances’ impact. This paper describes an optimal synthesis method based on curve fitted formula. Full wave electromagnetic simulator is first used to model a set of typical structures. Curve fitting technique is then used to express capacitance, inductance, Q-factor, SRF as functions of geometric parameters and frequency, which is then integrated in a software tool for package inductor and capacitor design. With these fitted curves, manufacture tolerance analysis becomes very easier, and one can easily find the optimal design for the real application, therefore speeds up the function block design.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Accelerated Convergence for Lumped-Elements Based on-Package RF Passives Design by Using Curve Fitted Formula Available to Purchase
Xiangyin Zeng,
Xiangyin Zeng
Intel Technology (Shanghai), Ltd., Shanghai, China
Search for other works by this author on:
Baoshu Xu
Baoshu Xu
Intel Technology (Shanghai), Ltd., Shanghai, China
Search for other works by this author on:
Xiangyin Zeng
Intel Technology (Shanghai), Ltd., Shanghai, China
Jiangqi He
Intel Corporation, Chandler, AZ
Baoshu Xu
Intel Technology (Shanghai), Ltd., Shanghai, China
Paper No:
IPACK2005-73308, pp. 1969-1972; 4 pages
Published Online:
March 4, 2009
Citation
Zeng, X, He, J, & Xu, B. "Accelerated Convergence for Lumped-Elements Based on-Package RF Passives Design by Using Curve Fitted Formula." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1969-1972. ASME. https://doi.org/10.1115/IPACK2005-73308
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