The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand (DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol solution on flexible polymer substrates. In a subtractive process, Nd:YAG pulsed laser was irradiated to produce finer electrical components. Continuous Ar laser was irradiated locally to evaporate carrier solution as well as to sinter gold nanoparticles. It is demonstrated for the first time, that the melting temperature depression of gold nanoink, combined with local laser heating and ablation can be used to fabricate micro electric components on low melting temperature polymer substrate to realize flexible electronics.

Volume Subject Area:
Micro- and Nanofabrication Processes
Keywords:
Flexible electronics, nanoparticle, gold, inkjet, laser, ablation, sintering
Topics:
Electrical components, Flexible electronics, Inks, Lasers, Low temperature, Nanoparticles
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Copyright © 2005
 by ASME
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