In this paper, simulation of the 2D flow of incompressible molten epoxy material in a mold cavity has been carried out. Characteristic Based Split (CBS) was used in its semi-implicit form to analyze the mold filling behavior in underfilling encapsulation process. A two dimensional numerical model was developed and the governing equations were solved by using Characteristic Based Split (CBS) method to get the velocity and pressure fields. The velocity filed was used in pseudo-concentration approach to track the flow front. Pseudo-concentration is based on the Volume of Fluid (VOF) technique and was used to track fluid front for each time step. Simulation has been carried out for a particular geometry of a flip-chip package. The model proposed could provide a means to simulate the underfilling process for flip chip package.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Numerical Model to Analyse IC Chip Encapsulation Process Available to Purchase
Venkatesh M. Kulkarni,
Venkatesh M. Kulkarni
University of Science Malaysia, Penang, Malaysia
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Ishak Abdul Azid,
Ishak Abdul Azid
University of Science Malaysia, Penang, Malaysia
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K. N. Seetharamu,
K. N. Seetharamu
University of Science Malaysia, Penang, Malaysia
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P. A. Aswatha Narayana
P. A. Aswatha Narayana
University of Science Malaysia, Penang, Malaysia
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Venkatesh M. Kulkarni
University of Science Malaysia, Penang, Malaysia
Ishak Abdul Azid
University of Science Malaysia, Penang, Malaysia
K. N. Seetharamu
University of Science Malaysia, Penang, Malaysia
P. A. Aswatha Narayana
University of Science Malaysia, Penang, Malaysia
Paper No:
IPACK2005-73197, pp. 1841-1848; 8 pages
Published Online:
March 4, 2009
Citation
Kulkarni, VM, Azid, IA, Seetharamu, KN, & Aswatha Narayana, PA. "Numerical Model to Analyse IC Chip Encapsulation Process." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1841-1848. ASME. https://doi.org/10.1115/IPACK2005-73197
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