We have developed a polyimide multi-layer substrate for semiconductor package. Interstitial via holes filled with conductive paste make the electrical connection in any layers in the multi-layer substrate to realize high-density wiring. The substrate shows reliable resistance to moisture and heat. Use of polyimide film make the substrate considerable thin compared to the conventional method using glass-epoxy. The present multi-layer substrate can be applied to a promising interposer for high-density semiconductor such as multi-chip module and stacked chip.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Polyimide Multi-Layer Substrate for High-Density Semiconductor Package
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Takenaka, S, Ito, S, Kishihara, R, Okamoto, M, & Nakao, O. "Polyimide Multi-Layer Substrate for High-Density Semiconductor Package." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1779-1782. ASME. https://doi.org/10.1115/IPACK2005-73065
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