Ratchetting deformations of solder alloys are significant deformations for the safety and reliability of solder joints of electronic packaging. This paper discusses a correlation between creep and uniaxial ratchetting deformations to clarify the difference in the time-dependent deformations between lead-free and lead-containing solder alloys. Uniaxial ratchetting tests are conducted by cyclic tension-compression and cyclic tension-unloading with the several ratios of maximum to minimum stresses. Additional creep tests are also conducted after the uniaxial ratchetting tests to clarify the effect of the uniaxial ratchetting on the creep deformation. A method to evaluate the uniaxial ratchetting deformation is discussed using the creep curves. The results show that the uniaxial ratchetting deformation correlates to the creep deformation and that the correlation is different between the lead-free and lead-containing solder alloys.
Skip Nav Destination
ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys Available to Purchase
Katsuhiko Sasaki,
Katsuhiko Sasaki
Hokkaido University, Sapporo, Japan
Search for other works by this author on:
Takuji Kobayashi,
Takuji Kobayashi
Hokkaido University, Sapporo, Japan
Search for other works by this author on:
Ken-Ichi Ohguchi
Ken-Ichi Ohguchi
Akita University, Akita, Japan
Search for other works by this author on:
Katsuhiko Sasaki
Hokkaido University, Sapporo, Japan
Takuji Kobayashi
Hokkaido University, Sapporo, Japan
Ken-Ichi Ohguchi
Akita University, Akita, Japan
Paper No:
IPACK2005-73054, pp. 1773-1778; 6 pages
Published Online:
March 4, 2009
Citation
Sasaki, K, Kobayashi, T, & Ohguchi, K. "Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1773-1778. ASME. https://doi.org/10.1115/IPACK2005-73054
Download citation file:
6
Views
Related Proceedings Papers
Related Articles
Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions
J. Electron. Packag (September,2005)
Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation
J. Electron. Packag (September,2003)
A Damage-Mechanics-Based Constitutive Model for Solder Joints
J. Electron. Packag (September,2005)
Related Chapters
Basic Concepts
Design & Analysis of ASME Boiler and Pressure Vessel Components in the Creep Range
Reliability of Electronic Packaging
Essentials of Electronic Packaging: A Multidisciplinary Approach
Members in Compression
Design & Analysis of ASME Boiler and Pressure Vessel Components in the Creep Range