Ratchetting deformations of solder alloys are significant deformations for the safety and reliability of solder joints of electronic packaging. This paper discusses a correlation between creep and uniaxial ratchetting deformations to clarify the difference in the time-dependent deformations between lead-free and lead-containing solder alloys. Uniaxial ratchetting tests are conducted by cyclic tension-compression and cyclic tension-unloading with the several ratios of maximum to minimum stresses. Additional creep tests are also conducted after the uniaxial ratchetting tests to clarify the effect of the uniaxial ratchetting on the creep deformation. A method to evaluate the uniaxial ratchetting deformation is discussed using the creep curves. The results show that the uniaxial ratchetting deformation correlates to the creep deformation and that the correlation is different between the lead-free and lead-containing solder alloys.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys
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Sasaki, K, Kobayashi, T, & Ohguchi, K. "Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1773-1778. ASME. https://doi.org/10.1115/IPACK2005-73054
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