This paper describes design, fabrication and preliminary characterization of a proof-of-concept vertical-travel microactuator, providing linear motion and high precision positioning in space. The microactuator is capable of providing latching function when it is un-powered to maintain its position. The microactuator consists of two opposing comb drive actuator dies, a slider and bulk PZT actuators sandwiched between the dies. The slider is inserted between clutches. Comb drives are connected to the clutches to engage/disengage clutching. Sequential activation of the comb drives (in-plane motion) and the PZT actuator (out-of-plane motion) provides cumulative linear travel of the slider. The novelty of the slider insertion approach include (1) post-fabrication engagement of comb teeth enabling thick wafer DRIE process for comb drive actuators and (2) stressed tethers enabling zero-power latching. A test device was fabricated and assembled. By applying 100V∼300V DC to the electrostatic comb drive, lateral actuation of clutches was observed. Vertical actuation by PZT was also confirmed using WYKO RST plus interferometer.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Development of Latching Type Large Vertical-Travel Microactuator Available to Purchase
Risaku Toda,
Risaku Toda
Jet Propulsion Laboratory, Pasadena, CA
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Eui-Hyeok Yang
Eui-Hyeok Yang
Jet Propulsion Laboratory, Pasadena, CA
Search for other works by this author on:
Risaku Toda
Jet Propulsion Laboratory, Pasadena, CA
Eui-Hyeok Yang
Jet Propulsion Laboratory, Pasadena, CA
Paper No:
IPACK2005-73390, pp. 1755-1759; 5 pages
Published Online:
March 4, 2009
Citation
Toda, R, & Yang, E. "Development of Latching Type Large Vertical-Travel Microactuator." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1755-1759. ASME. https://doi.org/10.1115/IPACK2005-73390
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