Advances in processor design have been made possible in part by increases in the packaging density of electronics. At the same time, combination of increased power dissipation and packaging density has led to substantial growth in the chip and system heat fluxes and amplified complexity in electrical signal integrity and mechanical stack-up design in the recent years, particularly, in the high-end computers. With the trend towards miniaturization, heat removal, along with increased reliability requirements, has become a major bottleneck in product development, especially, in low profile systems, telecom servers and blades. Cooling of high heat flux components may require consideration of innovative open-loop, as well as plausible closed-loop, cooling designs for data centers. This paper addresses reliability aspects of thermal, electrical, mechanical, and interconnect design and long-life operation of high-end air-cooling, as well as feasible active open and closed-loop cooling technologies of high heat flux processors.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Reliability Challenges in Design and Operation of High Heat Powered Processors Available to Purchase
Ali Heydari,
Ali Heydari
Sun Microsystems, Inc., Sunnyvale, CA
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Vadim Gektin
Vadim Gektin
Sun Microsystems, Inc., Sunnyvale, CA
Search for other works by this author on:
Ali Heydari
Sun Microsystems, Inc., Sunnyvale, CA
Vadim Gektin
Sun Microsystems, Inc., Sunnyvale, CA
Paper No:
IPACK2005-73461, pp. 1665-1668; 4 pages
Published Online:
March 4, 2009
Citation
Heydari, A, & Gektin, V. "Reliability Challenges in Design and Operation of High Heat Powered Processors." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1665-1668. ASME. https://doi.org/10.1115/IPACK2005-73461
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