This paper discusses the design and integration of RF filters in multilayer organic substrate. Using a methodic approach, several low-pass and band-pass filters have been designed, fabricated and fully characterized. The electrical analysis clearly indicates, which of the low-pass filters is less susceptible to process variations and therefore more appropriate for high volume manufacturing. It is shown that these filters provide electrical performance similar to their commercially available ceramic counterparts while using relatively smaller real estate. All filters are fabricated in the innermost layers of a multilayer organic package substrate with embedded passives capability.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Embedded RF Filters for WLAN and Bluetooth Applications
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Kamgaing, T, He, J, & Hsu, R. "Embedded RF Filters for WLAN and Bluetooth Applications." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1621-1624. ASME. https://doi.org/10.1115/IPACK2005-73319
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