In this paper, the development of three-dimensional (3-D) millimeter-wave functions in multilayer low temperature cofired ceramic (LTCC) and liquid crystal polymer (LCP) technologies is presented for millimeter-wave compact and easy-to-design passive solutions for high data rate wireless systems. Both ceramic and organic technologies are candidates for the 3-D integration of system-on-package (SOP) miniaturized RF/microwave/millimeter-wave systems. LTCC has been widely used as a packaging material because of its process maturity/stability and its relatively high dielectric constant that enables a significant reduction in the module/function dimensions. As an alternative, LCP is an organic material that offers a unique combination of electrical, chemical, and mechanical properties, enabling high-frequency designs due to its ability to act as both the substrate and the package for flexible and conformal multilayer functions. A LTCC patch resonator filter that uses vertical coupling overlap and transverse cuts as design parameters has been designed to achieve a high level of miniaturization and a great compromise between compactness and power handling. Excellent agreement between the simulation and the measurement has been verified for two operating frequency bands (58–60GHz/38–40GHz) of RF communications and sensors for applications such as wireless broadband internet or inter-satellite communications. A band pass filter has been fabricated on LCP substrate, offering a very simple, low loss flexible and low lost filtering solution for wideband millimeter waves applications such as 60 GHz WLAN short-range gigabit wireless systems. The design exploits the ripple near the cut off frequency of Tchebysheff low pass filter to create a band pass response and it exhibits the insertion loss as low as 1.5 dB at the center frequency of 60GHz and 3-dB bandwidth of 16.7% (∼10 GHz).
- Heat Transfer Division and Electronic and Photonic Packaging Division
3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies
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Lee, J, Sarkar, S, Pinel, S, Papapolymerou, J, Laskar, J, & Tentzeris, MM. "3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1607-1611. ASME. https://doi.org/10.1115/IPACK2005-73127
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