This work investigated the motherboard coplanarity and preload correlation using the shadow moire´ interferometry. Motherboards under three different preloads in the CPU area were examined at room temperature and elevated temperature. Both the global board warpage and the local board warpage around the CPU area were measured for preload and temperature correlations. The measured board coplanarity was correlated to the board preload successfully. The results clearly identified a failure mode from the outlier, which has totally different warpage shape and corresponds to the uneven preload case. Also, the creep effect under preload during heating stage was observed and quantified.
Volume Subject Area:
Manufacturing and Test of Electronic and Photonic Systems
Topics:
Shades and shadows,
Warping,
Temperature,
Creep,
Failure mechanisms,
Heating,
Interferometry,
Shapes
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Copyright © 2005
by ASME
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