This paper outlines and discusses the new mechanical characterization metrology applied on PCI board. The dynamic responses of PCI board were monitored and characterized using accelerometers and strain gauges. PCI board bend modes were analyzed to differentiate high risk areas through analysis of board strain responses to solder joint crack performance. Key influences, such as thermal/mechanical enabling preload masses and profiled shock on solder joint crack severity were also conducted to understand the potential SJR performance risk modulators. Commercial simulation software analysis tool was applied to correlate and predict the board’s bend modes; providing key information for product enabling solutions design. With this new characterization and validation concept, a practical stiffener solution for PCI application was designed to improve board SJR performance in its application condition.
- Heat Transfer Division and Electronic and Photonic Packaging Division
A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application
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Wong, SF, Loh, WK, Lee, YH, Yap, EH, Wong, SW, & Hin, TY. "A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1441-1447. ASME. https://doi.org/10.1115/IPACK2005-73215
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