This paper is a step towards building a more complete theory of compact thermal models, in which their common structure is highlighted and hence the sources of errors inevitably present in any compact model clearly revealed. This approach is further extended in order to propose an original approach to attain any desired level of precision. Different methods already proposed by other authors can all benefit from the approach proposed here in order to raise accuracy level. Traditionally, increasing precision was attained by increasing the number of nodes. This strategy faces many problems, like the difficulty to select node size and position, as well as the inability to provide an a priori estimate of the number of nodes needed. In particular, this strategy fails in the case of multiple heat sources (MCM). The actual approach relies on a “flexible” pattern model that allows us to avoid such problems. Moreover, the new approach gives access to the tangential temperature gradient. This valuable information for designers in order to assess reliability can not be predicted by classical compact model approaches.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
High Precision Compact Thermal Models
Mohamed-Nabil Sabry
Mohamed-Nabil Sabry
French University in Egypt, Cairo, Egypt
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Mohamed-Nabil Sabry
French University in Egypt, Cairo, Egypt
Paper No:
IPACK2005-73051, pp. 1379-1387; 9 pages
Published Online:
March 4, 2009
Citation
Sabry, M. "High Precision Compact Thermal Models." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1379-1387. ASME. https://doi.org/10.1115/IPACK2005-73051
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