Parallel optical interconnects (POIs) offer capacity advantages for high-density telecomm requirements. Once an array of multi-channel, high-capacity POIs is placed on a board, shelf or telecom rack, it creates a challenging thermal management task. To develop a thermal management concept for high dissipating racks (over 10 kW), capable of keeping a maximum temperature of 80°C for optical components, with tight temperature uniformity requirements of ±1°C between a receiver (Rx) and transmitter (Tx), a fully functional two-shelf telecommunication rack has been built. A thermal management solution was proposed and was based on the implementation of heat pipes embedded into each board. The performance of embedded heat pipes is characterized for densely packaged, high-speed optics applications requiring temperature uniformity and stringent temperature limits. The proposed solution completely meets requirements of power-dense, high speed POIs at the board/shelf level for the typical telecommunication rack. Moreover, it evolves into an enabling strategy for the reliable control of power-dense, temperature-sensitive optical components.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Performance Characterization of a Thermal Management Concept for High-Density, High-Speed Parallel Optical Interconnects
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Vukovic, A, & Savoie, M. "Performance Characterization of a Thermal Management Concept for High-Density, High-Speed Parallel Optical Interconnects." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1375-1377. ASME. https://doi.org/10.1115/IPACK2005-73039
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