As the electronics industry continues to push for miniaturization, several reliability factors become vital issues. The demand for a high population of smaller and smaller solder bumps, while also increasing the current, have resulted in a significant increase in the current density. As outlined in the International Technology of Roadmap for Semiconductors (ITRS), this trend makes electromigration the limiting factor in high density packages. The heightened current density and correspondingly elevated operating temperatures are a critical issue in reliability since these factors facilitate the effects of electromigration. Therefore, as bump sizes continue to decrease, the study of electromigration reliability becomes crucial in order to understand and possibly prevent the causes of failure. A systematic study of electromigration in eutectic SnPb and Pb-free solder bumps was conducted in order to characterize the reliability of the Micro SMD package family. The testing includes both eutectic 63Sn-37Pb and 95.5Sn4.0Ag-0.5Cu solder bumps on an Al/Ni(V)/Cu under-bump-metallization. Mean-time-to-failure results are compared to Black’s Equation and cross-sections of the solder bumps are shown to analyze the mechanisms that led to failure.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Lead-Free and PbSn Bump Electromigration Testing Available to Purchase
Stephen Gee,
Stephen Gee
National Semiconductor, Santa Clara, CA
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Nikhil Kelkar,
Nikhil Kelkar
National Semiconductor, Santa Clara, CA
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Joanne Huang,
Joanne Huang
University of California at Los Angeles, Los Angeles, CA
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King-Ning Tu
King-Ning Tu
University of California at Los Angeles, Los Angeles, CA
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Stephen Gee
National Semiconductor, Santa Clara, CA
Nikhil Kelkar
National Semiconductor, Santa Clara, CA
Joanne Huang
University of California at Los Angeles, Los Angeles, CA
King-Ning Tu
University of California at Los Angeles, Los Angeles, CA
Paper No:
IPACK2005-73417, pp. 1313-1321; 9 pages
Published Online:
March 4, 2009
Citation
Gee, S, Kelkar, N, Huang, J, & Tu, K. "Lead-Free and PbSn Bump Electromigration Testing." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1313-1321. ASME. https://doi.org/10.1115/IPACK2005-73417
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