Solders are used extensively as electrical interconnects in microelectronics packaging. Because of environmental concerns, lead-based solders are being replaced by Sn/Ag and Sn/Ag/Cu based solder materials. Since the thermomechanical reliability of modern electronic devices depends on, to a large extent, the fatigue and creep behavior of the solder joints, it is imperative to understand the deformation behavior of these new lead-free solders. This study conducted extensive thermomechanical testing on several commercial lead-free solder alloys. Anand viscoplastic model was used to describe the behavior of these materials with new curve fitting techniques. A modified Anand models was proposed that can yield a more accurate description of lead-free solders.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Constitutive Modeling of Lead-Free Solders
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Pei, M, & Qu, J. "Constitutive Modeling of Lead-Free Solders." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1307-1311. ASME. https://doi.org/10.1115/IPACK2005-73411
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