Since the VLSI processors are increasing power in accordance with exponential law, cooling solutions for such as personal computers have been evolving for over a decade. Recent heat sinks are designed with high dense fins and low profile to adapt to a high heat flux source within a slim enclosure. To achieve such compact cooling solution, thin fin and small gap is desirable. In addition, the pumping power is also limited by the allowable narrow space for fans. Thus it is important to minimize the thermal resistance for given pumping power that we define the optimum. Due to the lack of literatures on topic of low profile and high dense fins experiments, an apparatus was specially built to measure the thermal and fluid dynamic performance at the same time. Since such a high dense fin arrangement requires extra space on the sides by manufacturing reasons, the impact of bypass flow needs to be considered. The experiments are carefully carried out and the results are precisely compared with numerical analysis. The numerical model aiming to find the optimum for given pumping power is discussed with extrapolating the data points. This report is concluded with the best configuration of plate fins of low profile heat sinks for a given fan performance.
Skip Nav Destination
ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Empirical Optimization of High Density Plate-Fin Heat Sink for Constant Pumping Power in Low Profile Cooling Application
Kazuaki Yazawa,
Kazuaki Yazawa
Sony Corporation, Tokyo, Japan
Search for other works by this author on:
Tatsuro Yoshida,
Tatsuro Yoshida
Toyama Prefectural University
Search for other works by this author on:
Shinji Nakagawa,
Shinji Nakagawa
Toyama Prefectural University
Search for other works by this author on:
Masaru Ishizuka
Masaru Ishizuka
Toyama Prefectural University
Search for other works by this author on:
Kazuaki Yazawa
Sony Corporation, Tokyo, Japan
Tatsuro Yoshida
Toyama Prefectural University
Shinji Nakagawa
Toyama Prefectural University
Masaru Ishizuka
Toyama Prefectural University
Paper No:
IPACK2005-73106, pp. 129-135; 7 pages
Published Online:
March 4, 2009
Citation
Yazawa, K, Yoshida, T, Nakagawa, S, & Ishizuka, M. "Empirical Optimization of High Density Plate-Fin Heat Sink for Constant Pumping Power in Low Profile Cooling Application." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 129-135. ASME. https://doi.org/10.1115/IPACK2005-73106
Download citation file:
3
Views
Related Proceedings Papers
Related Articles
Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins
J. Electron. Packag (September,2009)
Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages
J. Electron. Packag (September,2000)
Related Chapters
Thermoelectric Coolers Are Hot
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Cooling of a Chip Utilizing a Heat Sink with Rectangular Fins
Everyday Heat Transfer Problems: Sensitivities to Governing Variables
Numerical Simulation Research on a Fixed Bed Gasifier
International Conference on Information Technology and Management Engineering (ITME 2011)