Historically, the most common failure analyses metrologies have been dye-and-pull, cross-sections, microscopy, optical and SEM. Using these traditional metrologies to find a root cause from a dynamic event can be very time consuming and sometimes inconclusive. The standard methodology is to work backward to reconstruct the “event” that caused or initiated failure. Often times the root cause is not immediately obvious and design improvements require an iterative process to identify the true root cause. This approach is costly in time, materials and resources. A high speed camera (HSC) allows identification of failure from a point of initiation. Using the point of initiation concept with reconstructive modeling allows a design team to discover potential initiating sources and better match a cause to the effect and implement corrective action. This decreases development time, minimizing product design cycle and increases market opportunities.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Using High Speed Camera for Electronic Board Failure Analysis Available to Purchase
Wade Hezeltine,
Wade Hezeltine
Intel Corporation, Hillsboro, OR
Search for other works by this author on:
Frank Z. Liang
Frank Z. Liang
Intel Corporation, Hillsboro, OR
Search for other works by this author on:
Wade Hezeltine
Intel Corporation, Hillsboro, OR
Frank Z. Liang
Intel Corporation, Hillsboro, OR
Paper No:
IPACK2005-73223, pp. 1193-1198; 6 pages
Published Online:
March 4, 2009
Citation
Hezeltine, W, & Liang, FZ. "Using High Speed Camera for Electronic Board Failure Analysis." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1193-1198. ASME. https://doi.org/10.1115/IPACK2005-73223
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