Micro-Via Reliability Study of High-Density Substrate

The micro-via dimension of substrate decreased rapidly as the I/O density of substrate dramatically increased to meet the high market needs. However, the strength of micro-via becomes weak, and will be easily broken during the manufacturing process or reliability test. The purpose of this study is to understand the key effective factors of the micro-via reliability with the 3D non-linear thermal stress analysis using the Multi-scaling modeling (submodeling) technique.