This paper presents a method of finite element analysis for calculating moisture concentration in non-isothermal and non-steady states of moisture for integrated circuit packages composed of dissimilar moisture-permeable materials. The method can address non-Fickian behavior of materials in moisture diffusivity. Specimens were put on a hot plate after pre-conditioning in a moist environment. Distribution of moisture concentration in the specimen used in adhesion strength measurement was calculated in the temperature-change process. Comparatively large change in moisture concentration occurs in the neighborhood of the dissimilar material interface during that process, demonstrating that adhesion strength between die-attach material and printed circuit board at high temperatures might have greater moisture-sensitivity than at low temperatures.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Adhesion Strength at High Temperatures Affected by Moisture for Die-Attach Materials of Integrated Circuit Packages
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Tanaka, H, & Numata, T. "Adhesion Strength at High Temperatures Affected by Moisture for Die-Attach Materials of Integrated Circuit Packages." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1153-1158. ASME. https://doi.org/10.1115/IPACK2005-73139
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