The high residual stress in an electronic package sometimes causes not only mechanical failure but also the instability of electronic functions. Therefore the residual stress in resin-molded electronic packages should be evaluated. In this paper, the residual stress in a resin-molded electronic package was evaluated by the combination of experimental method using a test chip including piezoresistive gauges and the finite element method (FEM). The linear thermal elastic analysis of the resin-molded electronic package was carried out using the three dimensional FEM model. Stress-free temperature for the analysis was experimentally determined using the piezoresistive test chip. It was demonstrated that the residual stress at room temperature obtained by the FEM analysis well corresponds with the stress measured using the test chip. It was found from the results that compressive residual stress of over 100MPa was distributed on the top surface of a semiconductor chip in a plastic package. This study presents a simple evaluation technology of the residual stress in resin-molded semiconductor chips using the combination of experimental and numerical methods.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Experimental and Numerical Evaluation of Residual Stress in IC Chips
Masaaki Koganemaru,
Masaaki Koganemaru
Fukuoka Industrial Technology Center, Fukuoka, Japan
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Noriyuki Miyazaki
Noriyuki Miyazaki
Kyoto University, Kyoto, Japan
Search for other works by this author on:
Masaaki Koganemaru
Fukuoka Industrial Technology Center, Fukuoka, Japan
Toru Ikeda
Kyoto University, Kyoto, Japan
Noriyuki Miyazaki
Kyoto University, Kyoto, Japan
Paper No:
IPACK2005-73110, pp. 1129-1134; 6 pages
Published Online:
March 4, 2009
Citation
Koganemaru, M, Ikeda, T, & Miyazaki, N. "Experimental and Numerical Evaluation of Residual Stress in IC Chips." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1129-1134. ASME. https://doi.org/10.1115/IPACK2005-73110
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