Cooling performances of small finned heat sinks were investigated in combined natural and forced air convection environment, and the way to use the data in designing a heat sink on a LSI package is explored. An experimental study was performed providing natural and forced air convection over the heat sink. Several heat sinks having different base areas, fin spacing and heights were tested. The test heat sink was heated up by an electrical heater to produce a specific heat flux on its base. The increase in fin temperature was measured by small thermocouples. In natural convection experiments, the effect of the supplied wattage on the temperature rise of the heat sink was examined. In forced convection experiments, a wind tunnel was used. The hear sink was set near the downstream end of the wind tunnel and a specific heat flux was applied to it. A correlation between the air velocity and the temperature rise of the heat sinks was developed. Furthermore, the results are reduced to non-dimensional expressions to facilitate the design of small heat sinks.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
The Performance of Small Heat Sinks for LSI Packages in Combined Natural and Forced Convection Air Flows
Masaru Ishizuka,
Masaru Ishizuka
Toyama Prefectural University, Kosugi, Toyama, Japan
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Shinji Nakagawa,
Shinji Nakagawa
Toyama Prefectural University, Kosugi, Toyama, Japan
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Toru Honma
Toru Honma
Toyama Prefectural University, Kosugi, Toyama, Japan
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Masaru Ishizuka
Toyama Prefectural University, Kosugi, Toyama, Japan
Shinji Nakagawa
Toyama Prefectural University, Kosugi, Toyama, Japan
Toru Honma
Toyama Prefectural University, Kosugi, Toyama, Japan
Paper No:
IPACK2005-73011, pp. 11-18; 8 pages
Published Online:
March 4, 2009
Citation
Ishizuka, M, Nakagawa, S, & Honma, T. "The Performance of Small Heat Sinks for LSI Packages in Combined Natural and Forced Convection Air Flows." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 11-18. ASME. https://doi.org/10.1115/IPACK2005-73011
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