The thermo-mechanical behavior of near eutectic lead-free SnAgCu (SAC) solder joints under Deep Thermal Cycling (DTC) and in-situ thermal loading was examined. Crossed polarizer, optical microscopy revealed that in ball grid array (BGA) solder joints, these Sn rich, Pb-free solders exhibit large grained Sn structures. After imaging, these SnAgCu solder joints were subjected to repeated thermal stresses under an inert atmosphere. Subsequent to this thermal loading, the samples were again examined with optical microscopy. Using both data sets, the intergrain strains and deformations were quantified by Digital image correlation, a full field optical measurement technique. The relations between the positions of grains as well as intermetallics compounds, their boundaries and Sn deformation fields were examined.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball
Seungbae Park,
Seungbae Park
State University of New York at Binghamton, Binghamton, NY
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Ramji Dhakal,
Ramji Dhakal
State University of New York at Binghamton, Binghamton, NY
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Lawrence Lehman,
Lawrence Lehman
State University of New York at Binghamton, Binghamton, NY
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Eric Cotts
Eric Cotts
State University of New York at Binghamton, Binghamton, NY
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Seungbae Park
State University of New York at Binghamton, Binghamton, NY
Ramji Dhakal
State University of New York at Binghamton, Binghamton, NY
Lawrence Lehman
State University of New York at Binghamton, Binghamton, NY
Eric Cotts
State University of New York at Binghamton, Binghamton, NY
Paper No:
IPACK2005-73058, pp. 1095-1100; 6 pages
Published Online:
March 4, 2009
Citation
Park, S, Dhakal, R, Lehman, L, & Cotts, E. "Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 1095-1100. ASME. https://doi.org/10.1115/IPACK2005-73058
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