Since electric products need more effective features in terms of being compact, small, thin and highly performant, a new concept to create the advanced JISSO is required. We have invented the film module manufacturing process, in which the semiconductor is embedded into the thermo-elastic film and wired directly to exposed bumps. In this device, the fundamental process which is the embedded semiconductor into the thermoplastic film PETG, has been developed. This process is essential for the embedded active components film. This technique can be applied to packaging, memory cards, smart cards, flexible multi layer film and so on. The embedding process has the following problems; 1) Stud bumps on the IC may not appear on the surface of the film, 2) Voids may appear in the film during a high temperature press, 3) ICs may crack under high pressure. Subsequently, we solved the thermoplastic film’s flow process during the heat compression process using the rigid-plastic FEM (Finite Element method) analysis. We solved the resin temperature and load during the heat pressing process. It was discovered that ICs (0.18mm) could embed into the PETG film (0.2mm) within 13s. Finally, we applied this embedding process with the contactless IC card, which achieved a distance of calls of 100mm.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Development of Film Module With Embedded Actives Available to Purchase
Daisuke Sakurai,
Daisuke Sakurai
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
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Norihito Tsukahara,
Norihito Tsukahara
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
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Kazuhiro Nishikawa,
Kazuhiro Nishikawa
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
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Takashi Akiguchi,
Takashi Akiguchi
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
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Kazuto Nishida,
Kazuto Nishida
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
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Takaya Kobayashi,
Takaya Kobayashi
Mechanical Design & Analysis Corporation, Chofu, Tokyo, Japan
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Mari Saito
Mari Saito
Mechanical Design & Analysis Corporation, Chofu, Tokyo, Japan
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Daisuke Sakurai
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
Norihito Tsukahara
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
Kazuhiro Nishikawa
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
Takashi Akiguchi
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
Kazuto Nishida
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
Takaya Kobayashi
Mechanical Design & Analysis Corporation, Chofu, Tokyo, Japan
Mari Saito
Mechanical Design & Analysis Corporation, Chofu, Tokyo, Japan
Paper No:
IPACK2003-35162, pp. 845-852; 8 pages
Published Online:
January 5, 2009
Citation
Sakurai, D, Tsukahara, N, Nishikawa, K, Akiguchi, T, Nishida, K, Kobayashi, T, & Saito, M. "Development of Film Module With Embedded Actives." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 845-852. ASME. https://doi.org/10.1115/IPACK2003-35162
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