Commercial-off-the-shelf (COTS) plastic encapsulated microcircuits (PEM) are candidate-packaging technologies for spacecraft due to their enhanced performance, lower weight and lower cost. Much of the electronics used in space applications would be considered obsolete by everyday standards. This is primarily due the cost and time required for full space qualification. In order to gain the performance available in today’s electronics, COTS PEMs offer a viable path. PEMs can weigh half as much as their counter part ceramic packages. A lighter package results in a smaller overall payload for the same board functionality, a concern of critical importance for space missions because the payload mass dictates the launch vehicle requirements. Costs can be potentially reduced by using screening, accelerated testing or partial qualification techniques to complement the existing commercial qualification as well as by the reduced package materials costs. Assessing the risk associated with potentially lower reliability devices, engineers within the commercial and aerospace industries are using trade-off and risk analysis to aid in reducing spacecraft system cost while increasing performance and maintaining high reliability. In this paper we will outline the issues facing the use of COTS PEMs for spaceflight hardware from the aspect of both the electronic active devices as well as their packages. Finally, we will provide some guidelines for their use.
Skip Nav Destination
ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Use of Plastic Commercial Off-the-Shelf (COTS) Microcircuits for Space Applications
R. David Gerke,
R. David Gerke
California Institute of Technology, Pasadena, CA
Search for other works by this author on:
Andrew A. Shapiro,
Andrew A. Shapiro
California Institute of Technology, Pasadena, CA
Search for other works by this author on:
Shri Agawal,
Shri Agawal
California Institute of Technology, Pasadena, CA
Search for other works by this author on:
David M. Peters,
David M. Peters
California Institute of Technology, Pasadena, CA
Search for other works by this author on:
Michael A. Sandor
Michael A. Sandor
California Institute of Technology, Pasadena, CA
Search for other works by this author on:
R. David Gerke
California Institute of Technology, Pasadena, CA
Andrew A. Shapiro
California Institute of Technology, Pasadena, CA
Shri Agawal
California Institute of Technology, Pasadena, CA
David M. Peters
California Institute of Technology, Pasadena, CA
Michael A. Sandor
California Institute of Technology, Pasadena, CA
Paper No:
IPACK2003-35351, pp. 801-808; 8 pages
Published Online:
January 5, 2009
Citation
Gerke, RD, Shapiro, AA, Agawal, S, Peters, DM, & Sandor, MA. "Use of Plastic Commercial Off-the-Shelf (COTS) Microcircuits for Space Applications." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 801-808. ASME. https://doi.org/10.1115/IPACK2003-35351
Download citation file:
15
Views
Related Proceedings Papers
Related Articles
Risk Assessment Methodology for Electric-Current Induced Drowning Accidents
ASME J. Risk Uncertainty Part B (September,2016)
The Great Out of the Small
Mechanical Engineering (November,2000)
Harnessing Experience for Efficient Medical Device Product Development
J. Med. Devices (June,2009)
Related Chapters
Identification and Analysis of Risk
Managing Risks in Design & Construction Projects
Engineering Design about Electro-Hydraulic Intelligent Control System of Multi Axle Vehicle Suspension
International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)
QRAS Approach to Phased Mission Analysis (PSAM-0444)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)