A series of experimental investigations with a new modified transient liquid crystal method on the studies related to the fluid flow and heat transfer characteristics in a channel installed with a heat sink have been successfully performed. The parametric studies on the local and average effective heat transfer characteristics for confined heat sinks have been explored. The influencing parameters and conditions include air preheating temperature at channel inlet, flow velocity and heat sink types. Besides, a concept of the amount of enhanced heat transfer (AEHT) is introduced and defined as the ratio of j/f. The j/f ratio is almost independent of Reynolds number for a specific confined heat sink. The j/f ratios are 0.0603 and 0.0124 for fully-confined and unconfined heat sinks, respectively.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Thermal Performance Measurement for Confined Heat Sinks by Using a Modified Transient Liquid Crystal Technique
S. T. Kuo,
S. T. Kuo
National Tsing Hua University, Hsinchu, Taiwan
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M. P. Wang,
M. P. Wang
National Tsing Hua University, Hsinchu, Taiwan
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M. C. Wu,
M. C. Wu
National Tsing Hua University, Hsinchu, Taiwan
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Y. H. Hung
Y. H. Hung
National Tsing Hua University, Hsinchu, Taiwan
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S. T. Kuo
National Tsing Hua University, Hsinchu, Taiwan
M. P. Wang
National Tsing Hua University, Hsinchu, Taiwan
M. C. Wu
National Tsing Hua University, Hsinchu, Taiwan
Y. H. Hung
National Tsing Hua University, Hsinchu, Taiwan
Paper No:
IPACK2003-35020, pp. 73-80; 8 pages
Published Online:
January 5, 2009
Citation
Kuo, ST, Wang, MP, Wu, MC, & Hung, YH. "Thermal Performance Measurement for Confined Heat Sinks by Using a Modified Transient Liquid Crystal Technique." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 73-80. ASME. https://doi.org/10.1115/IPACK2003-35020
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