For high-power electronic packages, it is generally accepted that the package-sink interface materials used in the thermal solution influence hot-spot temperature(s) and junction-to-ambient thermal resistance. In this article we show how these package-exterior materials can noticeably influence across-die temperature gradients also. The numerical results reveal that the across-die thermal gradient can nearly double over a narrow range of conductivities typical of commercially available package-sink interface materials. Results show that the chip hot-spot temperature can be reduced 4 to 7 C by increasing the thermal interface material conductivity from 1 to 3 W/mk. This improvement can reduce the total thermal resistance from chip to ambient.
- Electronic and Photonic Packaging Division
Influence of Package-Sink Interface Materials on Die Performance and Reliability
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Jung, HH, Ankireddi, S, Pecavar, S, & Jones, J. "Influence of Package-Sink Interface Materials on Die Performance and Reliability." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 641-645. ASME. https://doi.org/10.1115/IPACK2003-35304
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