In raised-floor data centers, the airflow rates through the perforated tiles must meet the cooling requirements of the computer servers placed next to the tiles. The data centers house a wide range of equipment, and the heat load pattern on the floor can be quite arbitrary and changes as the data center evolves. To achieve optimum utilization of the floor space and the flexibility for rearrangement and retrofitting, the designers and managers of data centers must be able to modify the airflow rates through the perforated tiles. The airflow rates through the perforated tiles are governed primarily by the pressure distribution under the raised floor. Thus, the key to modifying the flow rates is to influence the flow field in the plenum. This paper discusses a number of techniques that can be used for controlling airflow distribution. These techniques involve changing the plenum height and open area of perforated tiles, and installing thin (solid and perforated) partitions in the plenum. A number of case studies, using a mathematical model, are presented to demonstrate the effectiveness of these techniques.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Techniques for Controlling Airflow Distribution in Raised-Floor Data Centers
Kailash C. Karki,
Kailash C. Karki
Innovative Research, Inc., Plymouth, MN
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Suhas V. Patankar,
Suhas V. Patankar
Innovative Research, Inc., Plymouth, MN
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Amir Radmehr
Amir Radmehr
Innovative Research, Inc., Plymouth, MN
Search for other works by this author on:
Kailash C. Karki
Innovative Research, Inc., Plymouth, MN
Suhas V. Patankar
Innovative Research, Inc., Plymouth, MN
Amir Radmehr
Innovative Research, Inc., Plymouth, MN
Paper No:
IPACK2003-35282, pp. 621-628; 8 pages
Published Online:
January 5, 2009
Citation
Karki, KC, Patankar, SV, & Radmehr, A. "Techniques for Controlling Airflow Distribution in Raised-Floor Data Centers." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 621-628. ASME. https://doi.org/10.1115/IPACK2003-35282
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