This paper focuses on the effect on inlet rack air temperatures when rack flowrates are reduced. Reduced flowrates for the same heat loads results in higher air temperature differences across the rack and thereby higher air temperatures exiting the rack. The effect of the higher rack exhaust temperatures on the inlet rack air temperatures is the focus of this investigation. Only the above floor (raised floor) flow and temperature distributions were analyzed for a range of rack flowrates and with various flowrates exhausting from the perforated tiles. A Computational Fluid Dynamic (CFD) model was generated for the room with electronic equipment installed on a raised floor with particular focus on the effects on rack inlet temperatures of these high powered racks. Fourty racks of data processing (DP) equipment were arranged in rows in a data center cooled by chilled air exhausting from perforated floor tiles. The chilled air was provided by four A/C units placed inside a room 12.1 m wide × 13.4 m long. Since the arrangement of the racks in the data center was symmetric only one-half of the data center was modeled. The numerical modeling was performed using a commercially available finite control volume computer code called Flotherm (Trademark of Flomerics, Inc.). The flow was modeled using the k-e turbulence model. Results are displayed to provide some guidance on the design and layout of a data center.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced
Roger Schmidt,
Roger Schmidt
IBM Corporation, Poughkeepsie, NY
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Ethan Cruz
Ethan Cruz
IBM Corporation, Poughkeepsie, NY
Search for other works by this author on:
Roger Schmidt
IBM Corporation, Poughkeepsie, NY
Ethan Cruz
IBM Corporation, Poughkeepsie, NY
Paper No:
IPACK2003-35241, pp. 495-508; 14 pages
Published Online:
January 5, 2009
Citation
Schmidt, R, & Cruz, E. "Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 495-508. ASME. https://doi.org/10.1115/IPACK2003-35241
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