The airflow management for multi-board rack-mount equipment has to meet certain requirements including a minimum air velocity over the boards, uniform air velocity from board to board and from front to rear, and fan redundancy. These requirements have to be met within certain size, noise level and reliability constrains. Several configurations are usually considered: “push” or pressurized system, “pull” or vacuum system, and “push-pull” system. The purpose of this article is to demonstrate the airflow management design process for the three system configurations mentioned above, and to compare their optimum designs with each other given a set of geometrical constraints such as the overall dimensions of the equipment chassis, the card cage, and the type and thickness of the air filter. The design process is explained as a case study involving a typical multi-board rack mounted telecommunication chassis.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Optimum Airflow Management for Multi-Board Rack-Mount Equipment
Bhalchandra Puranik,
Bhalchandra Puranik
Applied Thermal Technologies, LLC, Santa Clara, CA
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Younes Shabany
Younes Shabany
Applied Thermal Technologies, LLC, Santa Clara, CA
Search for other works by this author on:
Bhalchandra Puranik
Applied Thermal Technologies, LLC, Santa Clara, CA
Younes Shabany
Applied Thermal Technologies, LLC, Santa Clara, CA
Paper No:
IPACK2003-35210, pp. 429-434; 6 pages
Published Online:
January 5, 2009
Citation
Puranik, B, & Shabany, Y. "Optimum Airflow Management for Multi-Board Rack-Mount Equipment." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 429-434. ASME. https://doi.org/10.1115/IPACK2003-35210
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