Graphite foams consist of a network of interconnected graphite ligaments and are beginning to be applied to thermal management of electronics. The thermal conductivity of the bulk graphite foam is similar to aluminum, but graphite foam has one-fifth the density of aluminum. This combination of high thermal conductivity and low density results in a specific thermal conductivity about five times higher than that of aluminum, allowing heat to rapidly propagate into the foam. This heat is spread out over the very large surface area within the foam, enabling large amounts of energy to be transferred with relatively low temperature difference. For the purpose of graphite foam thermosyphon design in electronics cooling, various effects such as graphite foam geometry, sub-cooling, working fluid effect, and liquid level were investigated in this study. The best thermal performance was achieved with the large graphite foam, working fluid with the lowest boiling point, a liquid level with the exact height of the graphite foam, and at the lowest sub-cooling temperature.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Thermal Characteristics of Graphite Foam Thermosyphon for Electronics Cooling Available to Purchase
Hongkoo Roh,
Hongkoo Roh
Electronics and Telecommunications Research Institute, Daejeon, South Korea
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Jungho Kim,
Jungho Kim
University of Maryland, College Park, MD
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Paul J. Boudreaux
Paul J. Boudreaux
University of Maryland, College Park, MD
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Hongkoo Roh
Electronics and Telecommunications Research Institute, Daejeon, South Korea
Jungho Kim
University of Maryland, College Park, MD
Paul J. Boudreaux
University of Maryland, College Park, MD
Paper No:
IPACK2003-35002, pp. 41-46; 6 pages
Published Online:
January 5, 2009
Citation
Roh, H, Kim, J, & Boudreaux, PJ. "Thermal Characteristics of Graphite Foam Thermosyphon for Electronics Cooling." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 41-46. ASME. https://doi.org/10.1115/IPACK2003-35002
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