The cooling of boards and components in telecommunication chassis is becoming progressively more challenging as the power dissipation of the components increases. The internet market is demanding higher speeds and the internet gear makers try to accommodate the increasing demand of the consumer. Hence there are situations where the power requirement for one rack unit of the chassis is reaching 500–600 W currently and expected to reach about 800–1000 W in 1–2 years. The power dissipations on components are currently in the vicinity of approximately 60–80 W and expected to reach roughly 100–120 W in the near future. This paper presents a design effort wherein a chassis has been analyzed and designed for a cooling capacity on the order of 600 W for the board to the extent that one is able to cool about 80 W for the ASICs and other components on the board.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Design Optimization of a Router Board Using Computational Fluid Dynamics
Timothy J. Dake,
Timothy J. Dake
Marquette University, Milwaukee, WI
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Joseph Majdalani,
Joseph Majdalani
Marquette University, Milwaukee, WI
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Susheela Narasimhan
Susheela Narasimhan
Cisco Systems, San Jose, CA
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Timothy J. Dake
Marquette University, Milwaukee, WI
Joseph Majdalani
Marquette University, Milwaukee, WI
Susheela Narasimhan
Cisco Systems, San Jose, CA
Paper No:
IPACK2003-35338, pp. 35-39; 5 pages
Published Online:
January 5, 2009
Citation
Dake, TJ, Majdalani, J, & Narasimhan, S. "Design Optimization of a Router Board Using Computational Fluid Dynamics." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 35-39. ASME. https://doi.org/10.1115/IPACK2003-35338
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