This paper reports on indirect cooling of high-power IC chips of notebook computers using a two phase closed thermosyphon loop with Fluorinert (FC-72) as the working fluid. The experimental set-up consists of an evaporator and a condenser connected by flexible tubing. The evaporator corresponds to a high-power IC chip, and the condenser represents a cooling plate located behind the display of notebook computer. The evaporator and the condenser have the outer dimensions of 50mm × 50mm × 20mm and 150mm × 200mm × 20mm, respectively. The effects of the heat input Q and the charged volume of Fluorinert liquid F on the heat transfer characteristics of the cooling system were studied experimentally. Further, the experiment for the evaporator with plate fin to enhance the boiling in the evaporator was carried out. It has been confirmed that the heater surface temperature for the evaporator with plate fin reduces about 10% in comparison with those for the evaporator without fin. It is found that enhancing the boiling in the evaporator is very effective to reduce the surface temperature of heater. In the case of the evaporator with the plate fin, the temperature difference between the heater surface and ambient is kept around 60K for the highest heat input Q = 30W in the present experiments.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Indirect Cooling of IC Chips Using a Two Phase Closed Thermosyphon Loop
Satoru Gima,
Satoru Gima
University of the Ryukyus, Okinawa, Japan
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Takashi Nagata,
Takashi Nagata
University of the Ryukyus, Okinawa, Japan
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Xing Zhang,
Xing Zhang
Kyushu University, Kasuga, Fukuoka, Japan
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Motoo Fujii
Motoo Fujii
Kyushu University, Kasuga, Fukuoka, Japan
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Satoru Gima
University of the Ryukyus, Okinawa, Japan
Takashi Nagata
University of the Ryukyus, Okinawa, Japan
Xing Zhang
Kyushu University, Kasuga, Fukuoka, Japan
Motoo Fujii
Kyushu University, Kasuga, Fukuoka, Japan
Paper No:
IPACK2003-35148, pp. 337-342; 6 pages
Published Online:
January 5, 2009
Citation
Gima, S, Nagata, T, Zhang, X, & Fujii, M. "Indirect Cooling of IC Chips Using a Two Phase Closed Thermosyphon Loop." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 337-342. ASME. https://doi.org/10.1115/IPACK2003-35148
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