The present investigation concluded that the thermal behavior of the laser diode can be numerically modeled using the parabolic transient conduction equation. In addition, the current study compared the thermal performance of the continuous wave pump lasers versus the modulated wave pump lasers. This comparison revealed that the temperature of the modulated wave pump laser can approach the temperature of the continuous wave pump laser with the same average power dissipation when the frequency approaches infinity. Finally, the resulting thermal behavior was correlated and expressed in an empirical form, which physically described the thermal performance of the modulating pump laser.
- Electronic and Photonic Packaging Division
Thermal Behavior of Next Generation of Raman Pump Lasers in Telco Equipment
Refai-Ahmed, G, & Trottier, S. "Thermal Behavior of Next Generation of Raman Pump Lasers in Telco Equipment." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 285-292. ASME. https://doi.org/10.1115/IPACK2003-35129
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