Heat transfer and fluid flow characteristics in a micro heat pipe with curved triangular grooves are investigated using numerical and experimental methods. In the numerical part, a one-dimensional mathematical model for micro heat pipe with curved triangular grooves is developed and solved to obtain the maximum heat transport rate, the capillary radius distribution, the liquid and the vapor pressure distributions along the axial direction of the micro heat pipe under the steady-state condition. In particular, the modified Shah method is applied to calculate the pressure drop induced by the liquid-vapor interfacial shear stress. Experiments are conducted to validate the numerical model. In the experiments, the micro heat pipe with 0.56 mm in hydraulic diameter and 50 mm in length is tested. The experimental results for the maximum heat transport rate agree well with those of the numerical investigations. Finally, thermal optimization of the micro heat pipe with curved triangular grooves is performed using the numerical model.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Modeling and Thermal Optimization of a Micro Heat Pipe With Curved Triangular Grooves
Kyu Hyung Do,
Kyu Hyung Do
Korea Advanced Institute of Science and Technology, Taejon, Korea
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Sung Jin Kim,
Sung Jin Kim
Korea Advanced Institute of Science and Technology, Taejon, Korea
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Gunn Hwang
Gunn Hwang
Electronics and Telecommunications Research Institute, Taejon, Korea
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Kyu Hyung Do
Korea Advanced Institute of Science and Technology, Taejon, Korea
Sung Jin Kim
Korea Advanced Institute of Science and Technology, Taejon, Korea
Gunn Hwang
Electronics and Telecommunications Research Institute, Taejon, Korea
Paper No:
IPACK2003-35116, pp. 271-278; 8 pages
Published Online:
January 5, 2009
Citation
Do, KH, Kim, SJ, & Hwang, G. "Modeling and Thermal Optimization of a Micro Heat Pipe With Curved Triangular Grooves." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 271-278. ASME. https://doi.org/10.1115/IPACK2003-35116
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