In the present study fluid flow and heat transfer characteristics of a microchannel heat sink subject to an impinging jet are experimentally investigated. In order to evaluate the cooling performance of a microchannel heat sink subject to an impinging jet under the fixed pumping power condition, the pressure drop across a microchannel heat sink and temperature distributions at the base of it are measured. Especially, a micro-thermal sensor array is manufactured with simple and convenient microfabrication processes to measure temperature distributions at the base of the heat sink accurately. Based on these experimental results, we suggest a correlation for the pressure drop across a microchannel heat sink subject to an impinging jet as well as a correlation for the thermal resistance of that. In addition, we show that the cooling performance of a microchannel heat sink subject to an impinging jet is superior to that of the microchannel heat sink subject to a parallel flow.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Fluid Flow and Thermal Characteristics for a Microchannel Heat Sink Subject to an Impinging Jet
Seok Pil Jang,
Seok Pil Jang
Korea Advanced Institute of Science and Technology, Taejon, Korea
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Sung Jin Kim
Sung Jin Kim
Korea Advanced Institute of Science and Technology, Taejon, Korea
Search for other works by this author on:
Seok Pil Jang
Korea Advanced Institute of Science and Technology, Taejon, Korea
Sung Jin Kim
Korea Advanced Institute of Science and Technology, Taejon, Korea
Paper No:
IPACK2003-35114, pp. 263-270; 8 pages
Published Online:
January 5, 2009
Citation
Jang, SP, & Kim, SJ. "Fluid Flow and Thermal Characteristics for a Microchannel Heat Sink Subject to an Impinging Jet." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 263-270. ASME. https://doi.org/10.1115/IPACK2003-35114
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