The heart of next generation networks is currently centered on building blocks for performing transport, switching, routing, amplification, attenuation, storage and conversion functions. One of the key elements of the network is a switch, which might perform as an optical switch (optical-electrical-optical, or OEO) or a “purely” photonic switch (optical-optical-optical or OOO). The merits and benefits of both in actual network applications are analyzed and outlined. Although both switches have their own advantages as a network element, the full judgement of their role in next generation networks requires an “overall network view”. Network functionalities such as grooming capabilities, scalability, traffic management, protection, line equalization or performance monitoring are those taken in competitive analyses in terms to understand some impacts of switch choice in the network. It is expected that both optical and photonic switches will play complementary roles in next generation networks. Combined with new communication technology advances in routing, transport, amplification and wavelength conversion, both switches will be the cornerstones of next generation solutions, each one with its specific role.
Skip Nav Destination
ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Towards Next Generation of Switching Available to Purchase
Alex Vukovic,
Alex Vukovic
Communications Research Centre, Ottawa, ON, Canada
Search for other works by this author on:
Michel Savoie,
Michel Savoie
Communications Research Centre, Ottawa, ON, Canada
Search for other works by this author on:
Heng Hua
Heng Hua
Communications Research Centre, Ottawa, ON, Canada
Search for other works by this author on:
Alex Vukovic
Communications Research Centre, Ottawa, ON, Canada
Michel Savoie
Communications Research Centre, Ottawa, ON, Canada
Heng Hua
Communications Research Centre, Ottawa, ON, Canada
Paper No:
IPACK2003-35043, pp. 25-28; 4 pages
Published Online:
January 5, 2009
Citation
Vukovic, A, Savoie, M, & Hua, H. "Towards Next Generation of Switching." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 25-28. ASME. https://doi.org/10.1115/IPACK2003-35043
Download citation file:
5
Views
Related Proceedings Papers
MEMS, MOEMS and Optoelectronics
IMECE2001
Related Articles
Challenges in Microscale Conductive and Radiative Heat Transfer
J. Heat Transfer (November,1994)
Special Section on InterPACK 2017—Part 2
J. Electron. Packag (June,2018)
Surface Current Improvement of Magnesium-Doped Hexagonal Boron Nitride Monolayer by Additional Nitrogen Gas Flow
J. Electron. Packag (September,2020)
Related Chapters
The Study of 640GBIT/S Routing Technology with Processing in Parallel
International Conference on Electronics, Information and Communication Engineering (EICE 2012)
Improving the Traffic Storage Based on Time Machine for Network Traffic
International Conference on Computer Engineering and Technology, 3rd (ICCET 2011)
Tolerating Memory Latency: L2 Cache Actively Push Structure
International Conference on Advanced Computer Theory and Engineering (ICACTE 2009)