A novel electronics cooling system that uses water heat pipes under an ambient temperature range from −30°C to 40°C has been developed. The system consists of several water heat pipes, air-cooled fins, and a metal block. The heat pipes are separated into two groups according to the thermal resistance of their fins. One set of heat pipes, which have fins with higher thermal resistance, operates under an ambient temperature range from −30°C to 40°C. The other set, which have lower resistance, operates from 0°C to 40°C. A prediction model based on the frozen-startup limitation of a single heat pipe was first devised and experimentally verified. Then, a prediction model for the whole-system was formulated according to the former model. The whole-system model was used to design a prototype cooling system, and it was confirmed that the prototype has a suitable cooling performance for an environmentally friendly electronics cooling system.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
A Novel Electronics Cooling System Using Water Heat Pipes Under Freezing Conditions
Osamu Suzuki,
Osamu Suzuki
Hitachi, Ltd., Tsuchiura, Ibaraki, Japan
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Atsuo Nishihara
Atsuo Nishihara
Hitachi, Ltd., Tsuchiura, Ibaraki, Japan
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Osamu Suzuki
Hitachi, Ltd., Tsuchiura, Ibaraki, Japan
Atsuo Nishihara
Hitachi, Ltd., Tsuchiura, Ibaraki, Japan
Paper No:
IPACK2003-35098, pp. 211-220; 10 pages
Published Online:
January 5, 2009
Citation
Suzuki, O, & Nishihara, A. "A Novel Electronics Cooling System Using Water Heat Pipes Under Freezing Conditions." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 211-220. ASME. https://doi.org/10.1115/IPACK2003-35098
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