A dynamic inverse method for measuring the thermal resistance of cooling device is described. The cooling device is held on a heat capacity block and heating the block higher than environment 50°C, then the thermal resistance of cooling device is deduced from the exponential decay in the temperature difference between the heat capacity block and the environment. This technique is different from conventional measurement in two ways. First, the thermal resistance is usually measured under steady state and always required much time, thus the dynamic measuring technique is needed. Second, the power of heater is always needed to control at a certain value exactly but it isn’t in inverse method. The result reveal that the test time is reduced from several tens minutes to few minutes and made to an accuracy of about ±2%. This rapid and reliable measurement technique is possible used in-line testing of cooling devices for industrial application.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
The Dynamic Inverse Method for Thermal Resistance of Cooling Device
Heng-Chieh Chien,
Heng-Chieh Chien
Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan
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Ming-Hsi Tseng,
Ming-Hsi Tseng
Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan
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Wen-Yang Chang
Wen-Yang Chang
Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan
Search for other works by this author on:
Heng-Chieh Chien
Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan
Ming-Hsi Tseng
Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan
Wen-Yang Chang
Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan
Paper No:
IPACK2003-35097, pp. 207-210; 4 pages
Published Online:
January 5, 2009
Citation
Chien, H, Tseng, M, & Chang, W. "The Dynamic Inverse Method for Thermal Resistance of Cooling Device." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2. Maui, Hawaii, USA. July 6–11, 2003. pp. 207-210. ASME. https://doi.org/10.1115/IPACK2003-35097
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