The use of CSPs has expanded rapidly, particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these applications. However, mechanical shock (drop) and bending requirements often necessitate the use of underfills to increase the mechanical strength of the CSP-to-board connection. Capillary flow underfills processed after reflow, provide the most common solution to improving mechanical reliability. However, capillary underfill adds board dehydration, underfill dispense, flow and cure steps and the associated equipment to the assembly process. Corner bonding provides an alternate approach. Dots of underfill are dispensed at the four corners of the CSP site after solder paste print, but before CSP placement. During reflow the underfill cures, providing mechanical coupling between the CSP and the board at the corners of the CSP. Since only small areas of underfill are used, board dehydration is not required. This paper examines the manufacturing process for corner bonding including dispense volume, CSP placement and reflow. Drop test results are then presented. A conventional, capillary process was used for comparison of drop test results. Test results with corner bonding were intermediate between complete capillary underfill and non-underfilled CSPs. Finite element modeling results for the drop test are also included.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Drop Reliability of Corner Bonded CSP in Portable Products
R. Wayne Johnson,
R. Wayne Johnson
Auburn University, Auburn, AL
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Sanan Abderrahman,
Sanan Abderrahman
Auburn University, Auburn, AL
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Jeffrey Suhling,
Jeffrey Suhling
Auburn University, Auburn, AL
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Larry Crane
Larry Crane
Henkel Loctite Corporation, Industry, CA
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Guoyun Tian
Auburn University, Auburn, AL
Yueli Liu
Auburn University, Auburn, AL
Pradeep Lall
Auburn University, Auburn, AL
R. Wayne Johnson
Auburn University, Auburn, AL
Sanan Abderrahman
Auburn University, Auburn, AL
Mike Palmer
Auburn University, Auburn, AL
Nokib Islam
Auburn University, Auburn, AL
Jeffrey Suhling
Auburn University, Auburn, AL
Larry Crane
Henkel Loctite Corporation, Industry, CA
Paper No:
IPACK2003-35318, pp. 897-905; 9 pages
Published Online:
January 5, 2009
Citation
Tian, G, Liu, Y, Lall, P, Johnson, RW, Abderrahman, S, Palmer, M, Islam, N, Suhling, J, & Crane, L. "Drop Reliability of Corner Bonded CSP in Portable Products." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 897-905. ASME. https://doi.org/10.1115/IPACK2003-35318
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