A compact microchip laser pumped by a single fiber coupled diode laser was developed for a scanning laser radar instrument called Laser Mapper (LAMP) to be used as a guidance and control sensor in future JPL/NASA missions [1]. The system involves commercial-off-the-shelf components that were packaged and qualified for space applications. In particular, the system has to meet a 5000 hour minimum life requirement on a LEO platform. This paper discusses the process being used and the results of the selection and qualification of a low cost prepackaged diode laser with a custom packaged microchip laser crystal. The environmental testing would be applicable to a variety of commercial photonic systems. The topics to be discussed include: • The selection of the diode pump laser; • Upscreening of commercial parts; • Qualification sampling tests including temperature cycling, vibration, outgassing; • Physical construction analysis. The testing requirements and screening flow to ensure the lifetime reliability will be presented. This was determined based on input from Telcordia standards that apply to optoelectronic systems used in the telecommunications industry but upgraded to account for the unique aspects of the devices, such as the high optical power. The key elements in packaging high power optoelectronic devices for harsh environments include managing the thermal loading through the expected spacecraft temperature extremes and addressing the die mounting, optical fiber coupling and jacket assembly. Each of these aspects will be discussed in light of the testing results.
Skip Nav Destination
ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Qualification and Reliability Testing of a Microchip Laser System for Space Applications
M. W. Wright,
M. W. Wright
California Institute of Technology, Pasadena, CA
Search for other works by this author on:
D. Franzen,
D. Franzen
California Institute of Technology, Pasadena, CA
Search for other works by this author on:
H. Hemmati,
H. Hemmati
California Institute of Technology, Pasadena, CA
Search for other works by this author on:
M. Sandor
M. Sandor
California Institute of Technology, Pasadena, CA
Search for other works by this author on:
M. W. Wright
California Institute of Technology, Pasadena, CA
D. Franzen
California Institute of Technology, Pasadena, CA
H. Hemmati
California Institute of Technology, Pasadena, CA
M. Sandor
California Institute of Technology, Pasadena, CA
Paper No:
IPACK2003-35298, pp. 879-883; 5 pages
Published Online:
January 5, 2009
Citation
Wright, MW, Franzen, D, Hemmati, H, & Sandor, M. "Qualification and Reliability Testing of a Microchip Laser System for Space Applications." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 879-883. ASME. https://doi.org/10.1115/IPACK2003-35298
Download citation file:
6
Views
Related Proceedings Papers
Related Articles
Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
J. Electron. Packag (September,2011)
Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure
J. Electron. Packag (March,2002)
Solid-State LiDAR With Optimized Dynamic Beam Power Intensity for Reduced Thermal Load
ASME Open J. Engineering (January,2024)
Related Chapters
Introduction
Thermal Management of Telecommunication Equipment, Second Edition
Introduction
Thermal Management of Telecommunications Equipment
Nonmetallic Pressure Piping System Components 1 Part A: Experience With Nonmetallic Materials in Structural/Pressure Boundary Applications
Companion Guide to the ASME Boiler and Pressure Vessel Codes, Volume 1, Fifth Edition