The present study is aimed at investigating the effects of thermal aging and Au addition on the electrical resistance of solder balls (bumps) in flip chip (FC) and UltraCSP packages. The specimens include one FC with eutectic Sn-Ag-Cu solder bumps and two types of UltraCSP, which have 20-mil and 30-mil eutectic Sn-Pb solder balls, respectively. The thermal aging test is performed with thermal aging at 175°C for FC, and 150°C for CSPs for up to 2000 hours, respectively. The electrical resistance of each daisy-chain pair of solder balls is measured using the Four Point Kelvin Method. With the increase in thermal aging time, electrical resistance of CSPs without Au increases gradually. After 1000 hour, the resistance seems to level off. While the resistance of CSPs with Au addition ascends monotonically with prolonged thermal aging. For Sn-Ag-Cu flip chip solder bumps, at 175°C for only 24 hours, the electrical resistance of a daisy-chain pair of solder bumps drops substantially. From 24 to 2000 hours, the electrical resistance increases at first and soon becomes stable. The change in the electrical resistance is related to the microstructural evolution in the solder balls.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages
Xingjia Huang,
Xingjia Huang
Hong Kong University of Science and Technology, Kowloon, Hong Kong
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S. W. Ricky Lee,
S. W. Ricky Lee
Hong Kong University of Science and Technology, Kowloon, Hong Kong
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Ming Li,
Ming Li
Institute of Materials Research & Engineering (IMRE), Singapore
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William Chen
William Chen
ASE Technologies, Inc., San Jose, CA
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Xingjia Huang
Hong Kong University of Science and Technology, Kowloon, Hong Kong
S. W. Ricky Lee
Hong Kong University of Science and Technology, Kowloon, Hong Kong
Ming Li
Institute of Materials Research & Engineering (IMRE), Singapore
William Chen
ASE Technologies, Inc., San Jose, CA
Paper No:
IPACK2003-35246, pp. 831-836; 6 pages
Published Online:
January 5, 2009
Citation
Huang, X, Lee, SWR, Li, M, & Chen, W. "Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 831-836. ASME. https://doi.org/10.1115/IPACK2003-35246
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