Anisotropic Conductive Adhesive Film (ACF) has been used for electronic assemblies such as the connection between a Liquid Crystal Display (LCD) panel and a flexible print circuit board (FPC). ACF is expected to be a key technology for flip chip packaging and chip size packaging. The goal of our work is to provide an optimum design scheme to achieve the best combination of electrical performance and mechanical reliability for electronic packages using the ACF. This study presents an evaluation technology for the delamination of the ACF connections. We utilized the stress intensity factors of an interface crack between jointed dissimilar materials. The evaluation technology presented herein was found to provide reliability of an electronic package using the ACF connection during the solder reflow process.
- Electronic and Photonic Packaging Division
Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack
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Kim, W, Ikeda, T, & Miyazaki, N. "Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 741-747. ASME. https://doi.org/10.1115/IPACK2003-35093
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