It is known that the lifetime of the passivated metal line varies depending on kind and thickness of the passivation layer. The appropriate consideration of the effect of passivation on electromigration damage makes it possible to evaluate the reliability of the metal line with choosing kind or thickness of the passivation. This paper is focused on the effect of passivation thickness on the failure prediction. The failure prediction considering the passivation thickness is shown. First, the film characteristic constants depending on the passivation thickness are experimentally determined in the lines with three kinds of passivation thickness. Next, by extrapolating the obtained dependencies, the characteristic constants are determined to predict the lifetime of the line covered with the thicker passivation than that employed in the experiment, and the lifetime is predicted by the reliability evaluation method based on the numerical simulation.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Prediction of Electromigration Failure in Passivated Polycrystalline Line Considering Passivation Thickness
Kazuhiko Sasagawa,
Kazuhiko Sasagawa
Hirosaki University, Hirosaki, Japan
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Masataka Hasegawa,
Masataka Hasegawa
Tohoku University, Sendai, Japan
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Naoki Yoshida,
Naoki Yoshida
Tohoku University, Sendai, Japan
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Hiroyuki Abe´
Hiroyuki Abe´
Tohoku University, Sendai, Japan
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Kazuhiko Sasagawa
Hirosaki University, Hirosaki, Japan
Masataka Hasegawa
Tohoku University, Sendai, Japan
Naoki Yoshida
Tohoku University, Sendai, Japan
Masumi Saka
Tohoku University, Sendai, Japan
Hiroyuki Abe´
Tohoku University, Sendai, Japan
Paper No:
IPACK2003-35065, pp. 723-728; 6 pages
Published Online:
January 5, 2009
Citation
Sasagawa, K, Hasegawa, M, Yoshida, N, Saka, M, & Abe´, H. "Prediction of Electromigration Failure in Passivated Polycrystalline Line Considering Passivation Thickness." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 723-728. ASME. https://doi.org/10.1115/IPACK2003-35065
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