Electronic packaging has several kinds of joint structures of metal, ceramic and polymer. It is well known that the stress singularity occurs at the vertex of joint where the dissimilar materials are bonded together. In this paper, the model in the first analysis is an electronic package using surface mount technology (SMT), the order of stress singularity is investigated, when the mechanical properties of solder, adhesive and resin vary for several values of contact angles between the solder with the chip and with a Cu land. Furthermore, the model in the second analysis is a Flip-Chip-on-Board packaging (FCOB), in which the order of stress singularity at the solder bump is investigated varying the mechanical properties of solder, underfill and the contact angle between the solder bump with a Cu track. After that, the displacement and stress fields for several values of the order of stress singularity are calculated by solving an eigen equation.
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ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
PROCEEDINGS PAPER
Three-Dimensional Stress Singularity Analysis Around the Solder Joints in Electronic Packaging Using Eigen Analysis
Monchai Prukvilailert,
Monchai Prukvilailert
Nagaoka University of Technology, Nagaoka, Niigata, Japan
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Hideo Koguchi
Hideo Koguchi
Nagaoka University of Technology, Nagaoka, Niigata, Japan
Search for other works by this author on:
Monchai Prukvilailert
Nagaoka University of Technology, Nagaoka, Niigata, Japan
Hideo Koguchi
Nagaoka University of Technology, Nagaoka, Niigata, Japan
Paper No:
IPACK2003-35054, pp. 709-716; 8 pages
Published Online:
January 5, 2009
Citation
Prukvilailert, M, & Koguchi, H. "Three-Dimensional Stress Singularity Analysis Around the Solder Joints in Electronic Packaging Using Eigen Analysis." Proceedings of the ASME 2003 International Electronic Packaging Technical Conference and Exhibition. 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1. Maui, Hawaii, USA. July 6–11, 2003. pp. 709-716. ASME. https://doi.org/10.1115/IPACK2003-35054
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